脉冲和锁相红外热成像检测技术的对比性研究  

Comparison between pulse and lock-in infrared thermography technology

作　　者：霍雁[1] 赵跃进[1] 李艳红[1] 张存林[2] 

机构地区：[1]北京理工大学信息科学学院,北京100081 [2]首都师范大学物理系,北京100048

出　　处：《激光与红外》2009年第6期602-604,共3页Laser & Infrared

基　　金：北京市教育委员会科技发展计划面上项目(No.KM200710028007);国家自然科学基金项目(No.10502035);973项目(No.2006CB605305)资助

摘　　要：脉冲红外热成像使用脉冲热源,热源中具有广泛的频率分量,而锁相红外热成像技术使用周期热源,热源频率单一。两种热成像技术的热源工作方式和数据处理方式不同,两种技术各有优缺点。本文利用两种技术分别对电路板和平底洞试件进行了检测,通过实验结果来说明两种热成像技术的区别以及各自的优缺点。Pulsed infrared thermography uses the pulsed heat source which has a plurality of frequencies, but lock-in infrared thermography uses the periodic heat source which has only a single frequency. Since the work-style of heat source and data processing method are different between these two technologies, the article uses the two above mentioned technologies to inspect the PCB and Back-drilled fiat bottom holes sample, according to the result of two technologies, differences between the two technologies and their advantages and disadvantages are presented.

关 键 词：脉冲红外热成像 锁相红外热成像 热源 位相 

分 类 号：TG115.28[金属学及工艺—物理冶金]