钢铁基体酒石酸盐碱性无氰镀铜  

Non-cyanide Copper Plating on Steel Substrate in Alkaline Tartrate Bath

作　　者：杨防祖[1] 宋维宝[1] 黄令[1] 姚光华[1] 周绍民[1] 

机构地区：[1]厦门大学化学化工学院固体表面物理化学国家重点实验室,福建厦门361005

出　　处：《电镀与精饰》2009年第6期1-4,20,共5页Plating & Finishing

基　　金：广东省教育部产学研结合专项资金项目(2006D90404019);福建省科技计划重点项目(2008H0086);国家自然科学基金项目(20873114)

摘　　要：以酒石酸盐为络合剂,胺化合物为辅助络合剂,研究钢铁基体上碱性无氰镀铜工艺,探讨了搅拌、镀液温度、pH、ρ(Cu2+)和添加剂对镀层外观的影响。考察了镀液的深镀能力和抗Fe2+、Fe3+、Zn2+及Sn4+杂质能力以及镀层与铁基体的结合力。实验结果表明:可以在宽广的工艺条件下获得光亮的铜镀层;阴极电流效率随温度、pH和ρ(Cu2+)提高而增大,在实验确定的工艺条件下ηκ为82%左右;镀液深镀能力达91%;计时电位曲线试验结果表明,基体上的钝化膜在沉积初期被破坏而处于活化状态,使得铜镀层与钢铁基体有足够的结合力。The process of non- cyanide copper electroplating on steel substrate was developed using tartrate as complexing agent and amine compound as assistant complexing agent. The effects of agitation, bath temperature,pH, ρ（Cu^2＋ ） and additive on deposit appearance were studied. The bath covering power, the ability of anti-impurities to Fe^2＋ , Fe^3＋ , Zn^2＋ , Sn^4＋ and adhesion of copper to steel substrate were tested. The results show that, in this bath the bright copper coating can be electrodeposited under wide condition ranges ; the current efficiency is about 82% and is increased with the increasing of bath temperature, pH and ρ（ Cu^2＋ ） ; the covering power of the bath is 91%. Chronopotentiometric curves prove that the passivation films on steel substrate could be spoiled at the early stage of electrodeposition and the substrate could be activated and therefore adhesion is strong enough between copper deposit and the substrate.

关 键 词：无氰镀铜 铁基体 酒石酸盐 电位活化 

分 类 号：TQ153.14[化学工程—电化学工业]