聚合物微结构热压成形设备的温度控制装置研究  

Research on Temperature Control System of Hot-embossing Equipment for Polymer Micro-structure

作　　者：张娜[1] 陈天宁[1] 王小鹏[1] 

机构地区：[1]西安交通大学机械工程学院,陕西西安710049

出　　处：《机械与电子》2009年第6期3-5,共3页Machinery & Electronics

基　　金：国家"八六三"计划资助项目(2006AA048330);国家自然科学基金资助项目(50705074)

摘　　要：针对一种新型可降解植入式药物载体的高效制备需要,进行聚合物多腔体微结构热压成形设备的温度控制装置和温度控制系统研制.设计了热压板与隔热板,并基于单片机和LabVIEW开发环境实现了对温度参数的测量和控制.For the needs of a new type of biodegradable implantable drug delivery, temperature control device and temperature control system of the hot - embossing equipment were designed and manufactured. Temperature control device included the design of the hot block and the heat insulation block. Temperature was measured and controlled based on the singlechip and the LabVIEW development environment.

关 键 词：聚合物微结构 热压成形 温度控制系统 

分 类 号：TP273.4[自动化与计算机技术—检测技术与自动化装置]