Z-pin增强陶瓷基复合材料I型应变能释放率  

Mode I Strain Energy Release Rate of Z-pin Reinforced CMC Laminate

作　　者：刘韡[1] 矫桂琼[1] 

机构地区：[1]西北工业大学力学与土木建筑学院,陕西西安710072

出　　处：《材料科学与工程学报》2009年第3期381-384,共4页Journal of Materials Science and Engineering

基　　金：高等学校博士学科点专项科研基金资助项目(20030699040)

摘　　要：碳纤维平纹编织物和碳纤维Z-pin制备的预成型体,通过化学气相渗透(CVI)工艺制成Z-pin增强平纹编织陶瓷基复合材料层压板。通过双悬臂梁试验研究Z-pin增强平纹编织陶瓷基复合材料层压板的层间I型应变能释放率和增强机理。研究Z-pin面积密度对层间I型应变能释放率的影响。结果表明:Z-pin增强平纹编织陶瓷基复合材料层压板主要增强机理表现为层间裂纹扩展受阻,Z-pin与层压板界面解离,Z-pin桥联裂纹和Z-pin拔出;增大Z-pin面积密度,层间I型应变能释放率增大。A preform consisting of plain woven carbon fabric and carbon fiber bundle Z-pins was prepared and then fabricated Z-pin reinforced plain-weave ceramic matrix composite （CMC） laminate by a chemical vapor infiltration （CVI）. The tests of double cantilever beam （DCB） were used on Z-pin reinforced plain-weave CMC laminates to investigate interlaminar mode I strain energy release rate and reinforced mechanisms. Effect of Z-pin areal density on interlaminar mode I strain energy release rate was studied. The results show that reinforced mechanisms of Z-pin plain-weave reinforced CMC laminate are mainly manifested as hindrance to interlaminar crack propagation, Z-pin and laminate interface debonding, crack bridging by Z-pins and Z-pins pullout, and that with the increase of Z-pins areal density interlaminar mode I strain energy release rate rises.

关 键 词：陶瓷基复合材料 应变能释放率 双悬臂梁 Z-PIN 

分 类 号：TB321[一般工业技术—材料科学与工程]