Cu含量对Bi5Sb钎料润湿性能和力学性能的影响  

Effect of content of Cu on wettability and mechanical property of Bi5Sb solder alloy

作　　者：闫焉服[1,2] 冯丽芳[1,2] 郭晓晓[1] 唐坤[1] 赵培峰[1] 

机构地区：[1]河南科技大学材料科学与工程学院,洛阳471003 [2]河南科技大学河南省有色金属材料科学与加工技术重点实验室,洛阳471003

出　　处：《中国有色金属学报》2009年第6期1055-1060,共6页The Chinese Journal of Nonferrous Metals

基　　金：国家"十一五"科技支撑计划资助项目(2006BAF04B14);河南省科技攻关资助项目(072102260016)

摘　　要：通过在Bi5Sb中添加不同含量的Cu形成新型BiSbCu三元合金。结果表明：在Bi5Sb钎料合金中添加0．5％～5．0％（质量分数）Cu，BiSbCu钎料合金的熔点变化不大，但其润湿性能和力学性能明显改善；当Cu含量为1．5％时，（Bi5Sb）1．5Cu钎料合金的润湿性能和力学性能最好，与基体Bi5Sb相比，（Bi5Sb）1．5Cu的铺展面积增大57．8％，抗拉强度提高212．4％；随着Cu含量的增大，针状组织Cu2Sb的含量逐渐增多，钎料合金性能下降。A new BiSbCu ternary alloy was formed by adding different contents of Cu into Bi5Sb solder alloy to improve its wettability and mechanical properties. The results show the effect of adding 0.5%-5.0% （mass fraction） Cu into Bi5Sb on the melting point of Bi5Sb solder alloy is not distinct, whereas the wettability and mechanical property are remarkably improved. Compared with the Bi5Sb matrix, the spreading area of （Bi5Sb）1.5Cu solder alloy increases 57.8% and the tensile strength increases 212.4% when the content of Cu is 1.5%. The number of needle-like Cu2Sb gradually increases with increasing Cu content, which weakens the properties of the solder alloy.

关 键 词：Bi5Sb钎料合金 CU 润湿性能 力学性能 

分 类 号：TG405[金属学及工艺—焊接]