电子浆料用Bi_2O_3-B_2O_3系无铅玻璃粉性能研究  

Study on the properties of Bi_2O_3-B_2O_3 lead-free glass powder used in electronic pastes

作　　者：乔文杰[1] 陈培[1] 贺雅飞[1] 陈小英[1] 

机构地区：[1]东华大学先进玻璃制造技术教育部工程研究中心,上海201620

出　　处：《电子元件与材料》2009年第7期53-56,共4页Electronic Components And Materials

基　　金：上海市重点学科建设资助项目(No.B603)

摘　　要：采用高温熔融水淬的方法,制备了w(Bi2O3)为50%～65%,w(B2O3)为25%～40%的Sb2O3掺杂Bi2O3-B2O3系玻璃粉体,研究了Bi2O3和B2O3含量对所制玻璃的玻璃转变温度tg、软化温度tf、线膨胀系数αl以及电阻率ρ等的影响。结果表明,随着w(Bi2O3)的增加,玻璃的tf缓慢下降并维持在490℃左右,熔封温度为550～600℃,αl从62.3×10–7/℃上升至69.1×10–7/℃;在80～200℃,玻璃的ρ为1011～1013Ω·cm。Sb2O3 doped Bi2O3-B2O3 glass powders, in which the contents of Bi2O3 and B2O3 were 50-65wt% and 25-40wt% respectively, were prepared through high-temperature melting, water quenching and grinding. The effect of the contents of Bi2O3 and B2O3 on the glass transition temperature tg, soft temperature tf, linear expansion coefficient at and resistivity 19 of prepared glass was studied. The results show that, with increasing Bi2O3 content, the tf of prepared glass decreases slightly and levels off at about 490℃, making the sealing temperature be in a range of 550-600 ℃, while the at increases from 62.3×10^-7/℃ to 69.1×10^-7℃. At 80-200℃, the ,ρ of prepared glass is in a range of 10^13-10^11 Ω.cm.

关 键 词：无机非金属材料 电子浆料 无铅玻璃粉 BI2O3 

分 类 号：TQ171[化学工程—玻璃工业]