一种新型印刷电路板蚀铜水的研制  

Development of a New-type copper-corrodent for etched plates

作　　者：阮复昌[1] 范娟[1] 莫炳禄[1] 公国庆[1] 卢燕玲[1] 

机构地区：[1]华南理工大学化学工程研究所,广州510641

出　　处：《广东化工》1998年第2期24-25,共2页Guangdong Chemical Industry

摘　　要：本文论述了一种新型印刷电路板蚀铜水及其开发思路和蚀铜动力学,研究结果表明,该蚀铜水不仅显著地提高了传统氨基蚀铜水的蚀铜速度,而且有效地抑制了氨的挥发,从而增加了蚀铜水的稳定性和蚀铜量,降低了生产成本。A new-type copper-corrodent for etched plates and its development rdea are reported in this paper, and its corroding dynamics is studied quite carefully. The experimental results show that the new-type copper-corrodent can accelerate the etching speed remarkably, and restrain the volatility of ammonia effectively, and therefore strengthen its stability, increase its capacity and decrease the production cost.

关 键 词：蚀铜水 动力学 印刷电路板 电子线路 腐蚀介质 

分 类 号：TN710.4[电子电信—电路与系统]