水解氯对电子胶粘剂用环氧树脂物化性能的影响  

Influence of Hydrolyzed Chlorine on Physical and Chemical Properities of Epoxy for Electronics Adhesive

作　　者：杜伟 

机构地区：[1]本诺电子材料科技有限公司

出　　处：《电子材料与电子技术》2009年第2期11-14,共4页Electronic Material & Electronic Technology

摘　　要：电子胶粘剂用环氧会对最终产品性能比如粘结强度和耐温性等产生一定的影响，本文将对三种不同公司的环氧进行比较和讨论。其中，水解氯的存在对固化时放热的峰温有着较小的影响，但是固化温度高于此温度，对固化没有影响。此外，水解氯对热分解温度有较大的影响，水解氯的存在导致环氧基的减少，交联密度的下降，最终导致耐热性的下降。在含有水解氯的侧链中有羟基以及醚键存在，会对提高界面的结合强度有一定帮助。This paper discussed and compared the properties such as adhesive strength and temperature resistance of the epoxy products from three companies. The hydrolyzed chlorine exerted a little influence on the peak temperature of the exothermic curing reaction, but no influence on cure since t he cure temperature is higher than the peak temperature of the exothermic curing reacbion, and a comparatively large effect on the thermal decomposition temperature. The existence of hydrolyzed chlorine resulted in the decrease of epoxy groups which limited the cmsslinking density and ultimately reduced the resistant temperature. The side chains incorporating hydrolyzed chlo- rine contained hydroxylgroups and ether bonds, both of which would improve the inteffacial bonding strength to some extent.

关 键 词：环氧 固化 水解氯 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业] TQ226.63