Al-20% Sn-4.5% Cu合金在高能球磨和烧结中的组织  

Microstructure of Al-20% Sn-4.5% Cu alloy during high energy ball milling and sintering processes

作　　者：马迎[1] 刘辛[1] 胡仁宗[1] 朱敏[1] 曾美琴[1] 

机构地区：[1]华南理工大学材料科学与工程学院,广东广州510640

出　　处：《金属热处理》2009年第6期59-62,共4页Heat Treatment of Metals

基　　金：2006年广东省自然科学基金团队项目

摘　　要：利用机械合金化方法制备Al-20%Sn-4.5%Cu合金粉末,将之压制成型后进行烧结。用X射线衍射仪(XRD)、扫描电镜(SEM)和差示扫描量热仪(DSC)分析了Al-20%Sn-4.5%Cu合金在高能球磨和烧结过程中的组织变化。结果表明,该合金粉末经40 h球磨后,可以获得纳米级Sn颗粒均匀弥散分布在Al基体上的组织,并且形成了Al(Cu)过饱和固溶体;在随后的烧结过程中,Sn相尺寸仍保持在200 nm左右,Al(Cu)过饱和固溶体则以CuAl相的形式脱溶析出。Al-20% Sn-4. 5% Cu alloy powder was prepared by high energy ball milling. Microstructure of the alloy during high energy ball milling and sintering processes was characterized by X-ray diffraction（ XRD）, scanning electron microscopy（SEM） and differential scanning calorimetry（DSC）. The results show that Sn nanoparticles are dispersed homogeneously in Al matrix microstructure by milling for 40 h in Al-20% Sn-4.5% Cu alloy powder. Meanwhile, A1 （Cu） supersaturated solid solution is formed during the milling process. In subsequent sintering process, Sn phase grows but the size still retains about 200 nm, and CuA12 phase precipitates from Al （ Cu ） supersaturated solid solution.

关 键 词：Al-Sn-Cu合金 高能球磨 烧结 组织 

分 类 号：TF124[冶金工程—粉末冶金] TG146.2[冶金工程—冶金物理化学]