新型低膨胀Mo-Cu合金电子封接材料研究  

The investigation on a new kind of Mo-Cu alloy material for electronic sealing material

作　　者：韩胜利[1] 宋月清[1] 崔舜[1] 夏扬[1] 

机构地区：[1]北京有色金属研究总院粉末冶金及特种材料研究所,北京100088

出　　处：《粉末冶金技术》2009年第3期189-192,共4页Powder Metallurgy Technology

摘　　要：本试验研究了添加活化元素N i对Mo-Cu合金的相对密度、烧结性能、热导率、电导率、热膨胀系数及组织的影响。研究结果表明:在Mo-Cu合金中加入N i能降低合金烧结的致密化温度,促进烧结的进行。但N i的加入降低了合金的导电和导热性能,并且使合金的组织变得粗大,75Mo-20Cu-5N i的导热系数和95%A l2O3陶瓷非常匹配,可被用作与其封接的合金。Mo-Cu alloys with the higher thermal conductivity and lower coefficient of thermal expansion is widely used as electrical packaging materials and heat sink materials. The effects of mass fraction of element Ni on the density, sintering properties, theromo-eonductivity, electric-conductivity, and microstructures of Mo-Cu alloys were investigated. The results indicate that addition of element Ni decreases the sintering densification temperature of the alloy. However, it is not beneficial to the theromo-conductivity and electric-conductivity and microstructures. 75Mo-20Cu-SNi alloy is a kind of good,matchable electronic sealing material for 95% Al2O3 ceram ics.

关 键 词：Mo—Cu合金 组织性能 致密化 

分 类 号：TF125.241[冶金工程—粉末冶金] TQ171.733[冶金工程—冶金物理化学]