氟硼酸盐镀铅添加剂的研究  

Research on Additives for Lead Electroplating in Fluoroborate Solution

作　　者：常林荣[1] 徐强[1] 唐致远[1] 于紫阳[1] 

机构地区：[1]天津大学化工学院,天津300072

出　　处：《电镀与精饰》2009年第7期34-36,39,共4页Plating & Finishing

摘　　要：采用了一种高性能氟硼酸盐镀铅添加剂,应用Hull槽试验、电化学测试及扫描电镜分析等手段进行了镀液及镀层性能检测,并将其与传统添加剂性能进行了比较。结果表明:该添加剂具有阴极电流密度范围宽、分散能力及深镀能力好等优点,所得镀层与基体结合力好。A high performance lead electroplating additive was investigated by means of Hull cell,electrochemical measurement and SEM observation. The performance of this additive was compared with those of traditional additives and the experimental results indicate that this additive is characterized by broader current density range, higher throwing power and better covering power of the bath and more excellent adhesion between coating and substrate.

关 键 词：铅 添加剂 电沉积 氟硼酸盐 

分 类 号：TQ153.19[化学工程—电化学工业]