FBG温度传感器增敏封装技术及实验研究  

Enhancing-sensitivity packaging technique and experimental study for fiber Bragg grating temperature sensor

作　　者：李永伟[1] 韩兴德[1] 于国庆[2] 

机构地区：[1]河北科技大学电气信息学院,石家庄050018 [2]河北科技大学信息科学与工程学院,石家庄050018

出　　处：《光学技术》2009年第3期461-463,共3页Optical Technique

基　　金：石家庄科学技术研究与发展计划课题(06713026A)

摘　　要：介绍了FBG（光纤布拉格光栅）温度传感器测温的基本原理和封装方法,提出一种新型的FBG温度传感器的封装技术,包括封装结构的设计及封装材料的合理选择,目的是提高FBG的温度敏感系数和消除应力的交叉影响。通过对裸光纤和封装后FBG温度传感器的温度特性、应力影响等进行对比实验研究,在5℃至90℃温度范围对FBG的反射波长进行了测量,结果表明：采用此法封装后的FBG温度传感器对温度具有很好的线性度和重复性,基本上消除了应力的影响,可以准确监测温度,测温范围为-15℃~200℃,精度达到±0.05℃。The basic principle and packaging methods of fiber Bragg grating （FBG）temperature sensor are introduced. A new packaging technique of FBG temperature sensor, which includes design of the packaging structure and the optimal choice for packaging material, is advanced. The purpose is to enhance the temperature sensitivity coefficient of FBG and to diminate cross-impact of stress, Through experiments, the temperature characteristics and stress impact of the naked and packaged FBG are contrasted, the reflective wavdength of FBG is measured from 5℃ to 90℃. The results show that the packaged FBG has good linearity and repeatability, and the stress impact is basically eliminated. The packaged FBG can be used accurately to monitor temperature. The temperature measurement ranges is from - 15℃ to 200℃. The accuracy is ±0.05℃.

关 键 词：光纤布拉格光栅(FBG) 封装方法 增敏技术 实验研究 

分 类 号：TP212.14[自动化与计算机技术—检测技术与自动化装置]