电沉积镍薄膜微观结构的动力学Monte Carlo模拟  

Kinetic Monte Carlo Simulation of the Microstructures of Electrodeposited Ni Thin Films

作　　者：黄跃宇[1] 周益春[1] 潘勇[1] 

机构地区：[1]湘潭大学材料与光电物理学院,低维材料及其应用技术教育部重点实验室,湘潭411105

出　　处：《材料导报》2009年第14期71-74,共4页Materials Reports

基　　金：国家自然科学基金杰出青年基金(10525211);国家自然科学基金重点项目(50531060)

摘　　要：采用动力学MonteCarlo方法模拟动力学控制条件下电沉积多晶镍薄膜的生长。研究了表面扩散对电镀薄膜微观结构的影响。模拟结果显示,溶液温度和沉积速率是2个非常重要的参数,它们能改变吸附原子的扩散能力,因而对薄膜的晶粒尺寸、相对密度、表面粗糙度等微观结构产生显著影响。此外,还得到该模式下薄膜的生长因子,大约为0.46。A kinetic Monte Carlo technique is adopted to simulate the growth process of electrodeposited polycrystalline Ni films on kinetically limited conditions. Effects of the surface diffusion on the microstructures of the plated films such as shape and size of grains, relative density and surface roughness are examined. Results show that the electrolyte temperature and the deposition rate are very important parameters which can change the diffusion ability of the adatoms to strongly influence the microstructures of the films. In additional, the growth exponent β is obtained, valued at 0. 46 approximately.

关 键 词：动力学Monte CARLO模拟 电沉积 镍薄膜 微观结构 

分 类 号：TB383[一般工业技术—材料科学与工程] TG502.31[金属学及工艺—金属切削加工及机床]