铝合金上化学镀Ni-Co-P合金工艺及镀层性能的初步研究  

Primary Study on Electroless Plating Ni-Co-P Process on Al Alloy Substrate and the Performances of the Coating

作　　者：胡佳[1] 方亮[1] 唐安琼[1] 李赟[1] 

机构地区：[1]重庆大学应用物理系,重庆400044

出　　处：《材料导报》2009年第14期99-101,112,共4页Materials Reports

基　　金：重庆市科技攻关项目(CSTC-2005AA4006-A6)

摘　　要：研究了铝硅合金基体化学镀Ni-Co-P镀层的工艺对镀层性能的影响。通过正交试验,得出镀液pH值、硫酸镍、硫酸钴以及次磷酸钠的含量对镀层厚度、硬度和成分的影响规律,发现增大镀液pH值和增加硫酸镍含量、次磷酸钠含量适中、降低硫酸钴含量,有利于增加镀层膜厚;增大镀液pH值、硫酸镍和次磷酸钠含量适中、降低硫酸钴含量,有利于提高镀层硬度。The influence of electroless plating process parameters on the performances of Ni-Co-P coating on a hyper-eutectic Al-Si casting alloy is studied by orthogonal experiment. The effects of process parameters, such as pH and the component in electroless plating bath on the performance of Ni-Co-P layer, such as the thickness and hardness,have been obtained. It is indicated that the thickness of Ni-Co-P electroless plated layer increases with the increase of pH and the NiSO4 · 6H2O concentration, the moderate NaH2PO2 · H2O concentration, and the decreasing of the CoSO4 · 7H2O concentration. The hardness of coating can be increased by increasing pH, using the moderate NiSO4 · 6H2O concentration and NaH2 PO2 · H2O concentration, and decreasing the CoSO4 · 7H2O concentration.

关 键 词：铝合金 化学镀 Ni—Co-P合金 镀层性能 

分 类 号：TQ153.1[化学工程—电化学工业] TQ153.2