芯片冷却用热管散热器的数值模拟研究  

The simulation of heat pipe heat sink for chip cooling

作　　者：诸凯[1] 刘建林[1] 陆佩强[1] 田金颖[1] 

机构地区：[1]天津商业大学天津市制冷技术重点实验室,天津300134

出　　处：《低温与超导》2009年第7期48-54,共7页Cryogenics and Superconductivity

摘　　要：随着计算机性能的提高,CPU散热量也持续增大,并导致了能量分布不均匀,所以高热流密度热控制或大型服务器的冷却处理方式已受到广泛关注。文中对大型计算机服务器CPU的耗能量、冷却效果等进行了实验研究,提出通过采用导热板扩大CPU散热面积的同时,采用高导热相变方法来解决高热流密度器件冷却的处理办法。研究结果证实,对高热流密度器件,依靠增大外界气流的速度来改善散热器的冷却性能并不明显,采用高效热管散热器来强化芯片传热,可满足计算机服务器CPU的冷却要求。With the development of computer, power dissipation of high flux electronics become critical and the energy distribution become non - uniform. Therefore the thermal control of electronic component with high heat flux or the cooling treatment of large - scale server has attracted the widespread attention. The study on the energy consumption and cooling performance of large - scale computer server is proposed in this dissertation. It is proposed that the hot plate is to enlarge the CPU radiating surface , at the same time, the phase transition technique with high heat transfer performance is used to cool the high heat flux component. The result shows that increaseing the outside air current to improve the cooling performance of radiator is not obvious. The cooling requirement of computer server can be satisfied by the highly effective heat pipe heat sink.

关 键 词：高热流密度器件 热控制 CPU 热管 散热器 

分 类 号：TP303[自动化与计算机技术—计算机系统结构] U262.231[自动化与计算机技术—计算机科学与技术]