Ag颗粒增强复合钎料钎焊接头蠕变断裂及强化机理研究  

Creep rupture and enhancement mechanism of Ag particle-enhancement composite solder joints

作　　者：闫焉服[1] 纪莲清[2] 张柯柯[1] 贺俊光[1] 赵丹娜[1] 

机构地区：[1]河南科技大学材料科学与工程学院洛阳471003 [2]郑州轻工业学院机电工程学院郑州,450002

出　　处：《材料科学与工艺》2009年第3期418-421,共4页Materials Science and Technology

基　　金：河南省科技攻关(072102260016);河南科技大学校基金(13420060)资助项目

摘　　要：测定了不同应力和温度下Ag颗粒增强复合钎料及基体钎料63Sn37Pb钎焊接头蠕变寿命,分析了Ag颗粒增强复合钎料及基体钎料钎焊接头蠕变断裂机理.表明:Ag颗粒增强复合钎料钎焊接头蠕变寿命优于基体钎料;Ag颗粒表面Ag-Sn金属间化合物形成及Ag颗粒对富Pb层阻碍作用是复合钎料钎焊接头蠕变性能提高的主要因素;钎焊接头Cu基板上一薄层富Pb相区形成是蠕变裂纹主要原因.The creep rupture lifetimes of Ag particle enhancement SnPb based composite solder joints and matrix solder joints were ,respectively tested under different temperatures and stresses ,and the creep rupture mechanism was analyzed. The creep resistance of the composite solder joints is superior to that of the matrix solder joints. The Cu6Sns intermetallic compound layer formed between the matrix and the counteract of Ag particles to creep behavior are the main reasons for the high creep resistance of the composite solder. A thin Pb - rich phase lying on the coop- er substrate of the composite solder joints directly causes the creep rupture of the solder joints.

关 键 词：Ag颗粒 复合钎料 蠕变寿命 蠕变断裂 蠕变强化机理 

分 类 号：TG405[金属学及工艺—焊接]