TC4/Cu/ZQSn10-2-3扩散连接接头微观分析  

Microstructural characterization of TC4/Cu/ZQSn10-2-3 diffusion bonded joints

作　　者：赵贺[1] 曹健[1] 冯吉才[1] 

机构地区：[1]哈尔滨工业大学现代焊接生产技术国家重点实验室,哈尔滨150001

出　　处：《焊接学报》2009年第7期37-40,共4页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(50805038;50375065)

摘　　要：TC4/ZQSn10-2-3直接扩散连接时,结合区由于生成CuSn3Ti5,Cu3Ti等金属间化合物及集聚的Pb质点,接头强度不高(τmax=102MPa),断口为脆性断口,并发生在靠近ZQSn10-2-3侧;填加金属中间层铜时,TC4/Cu/ZQSn10-2-3扩散连接接头强度获得显著提高(τmax=196MPa),这主要是铜中间层有效地抑制了Sn,Pb等元素向TC4侧的扩散,减少CuSn3Ti5,Cu3Ti等金属间化合物相生成,断口具有一定塑性;TC4/Cu/ZQSn10-2-3最佳扩散连接参数为:连接温度830℃,连接压力10MPa,连接时间30min.The experimental investigation on the diffusion bonding of TC4 to ZQSn10-2-3 was carried out in vacuum. CuSn3Ti5,Cu3Ti and rich-Pb layer were formed at the interface zone. The maximum joint strength was 102 MPa. Brittle fracture was explored after shear test,and occurred proximity to ZQSn10-2-3 side. Using copper as the interlayer,element Sn and Pb can be avoid diffusing from ZQSn10-2-3 to TC4. Then there were little CuSn3Ti5 in the interface. Fracture had certain plasticity,and the maximum strength of joint was 196 MPa. The optimum bonding parameters were:bonding temperature T=830 ℃,bonding pressure p=10 MPa and bonding time t=30 min.

关 键 词：钛合金 锡青铜 扩散连接 铜中间层 

分 类 号：TG457.1[金属学及工艺—焊接]