单晶硅纳米力学性能的测试  

Test of nanomechanical properties of single crystal silicon

作　　者：赵宏伟[1] 杨柏豪[2] 赵宏健[3] 黄虎[1] 

机构地区：[1]吉林大学机械科学与工程学院,吉林长春130022 [2]北京航天计量测试技术研究所力学室,北京100076 [3]浙江大学材料与化学工程学院,浙江杭州310027

出　　处：《光学精密工程》2009年第7期1602-1608,共7页Optics and Precision Engineering

基　　金：高等学校博士学科点专项科研基金(新)(No.20081831024);吉林省科技项目(No.SC0704083);吉林大学自然科学种子基金资助项目(No.498042320414)

摘　　要：对材料纳米力学性能测试手段进行了研究,着重分析了纳米压痕技术的原理和方法。结合纳米压痕技术,采用尖端四面体Vickers型单晶金刚石压头对单晶硅(100)晶面进行了纳米压痕实验测试。实验发现,在载荷为1000mN时,晶体硅出现了明显的裂纹和脆性断裂;而在载荷低于80mN的情况下,晶体硅则表现出延性特性。此外,在不同载荷条件下对晶体硅的硬度进行了实验测试,测试结果发现,不同载荷条件下晶体硅的硬度测量值存在较大的差异,认为导致这种差异的原因在于压痕区域晶体硅所受压力不同,使得晶体硅内部结构发生了改变,较为准确的单晶硅的硬度测量值为15.7GPa。The testing methods for nanomechanic properties of materials widely used in machining in micro-nano scale, MEMS/NEMS, biomedical engineering, material sciences etc. are researched and the main principle and methods of nanoindentation technology are analyzed. By a four-sided Vickers diamond indenter with a sharpened tip, the nanoindentation experiments are undertaken to test the single crystal silicon on （100） crystal surface with the help of a nanoindentation tester. Experiments show that the brittle crack is occurred around the nanoindentation zone on silicon surface when the maximum load of indentation is 1 000 mN. However, the crystal silicon shows plastic property when the maximum load of indentation is below 80 mN. Moreover, the hardness test of the crystal silicon with different loads is carried out, and the testing results show that the hardness is quite different in different loads. It is explained that the appeared phenomenon may come from the phase transformation under the nanoindentation zone inside the silicon wafer, because the pressure around the nanoindentation zone is different. The testing result of the hardness of single crystal silicon is about 15.7 GPa.

关 键 词：单晶硅薄片 纳米力学 纳米压痕 硬度 纳米级切削加工 

分 类 号：TN304.07[电子电信—物理电子学]