飞轮焊接温度场数值模拟研究  

Numerical Simulation of Flywheel Soldering Temperature Field

作　　者：张可[1] 武登云[1] 于国庆[1] 

机构地区：[1]北京控制工程研究所,北京100190

出　　处：《空间控制技术与应用》2009年第4期57-60,共4页Aerospace Control and Application

摘　　要：密封焊接是飞轮装配的关键工序,为了保证密封焊接的质量,需要确定焊接过程中飞轮的温度场分布情况.对某类型飞轮的焊接温度场进行了数值模拟,并将计算结果与试验测试数据进行对比和分析,结果表明:数值模拟与测试结果相吻合,有限元分析模型反映了飞轮在密封焊接过程中的温度场分布情况.Soldering seal is one of the most important processes in the flywheel assembly procedure. Appropriate distribution of temperature field is needed to ensure the quality of the soldering. In this paper, a temperature field of a flywheel is simulated and analyzed. And then, calculated results are compared with experimental data. The results show that calculated results are coincident with experimental data, and the finite element analysis model indicates the temperature field distribution in the soldering process correctly.

关 键 词：飞轮 焊接温度场 有限元分析 

分 类 号：TG402[金属学及工艺—焊接]