AlN陶瓷表面化学镀Ni-P合金  

Electroless Ni-P plating of Aluminum Nitride Ceramics

作　　者：夏章能[1] 徐洁[1] 

机构地区：[1]电子工业部23所第四研究室,上海200437

出　　处：《材料保护》1998年第6期19-22,共4页Materials Protection

摘　　要：在AlN陶瓷上化学镀Ni－P合金，使其表面金属化，研究镀液组成、pH值、镀液温度等对镀层性能和镀速的影响。结果表明，选择合理的工艺可以得到性能良好的镀层并可提高沉积速度，降低生产成本。沉积速度最明显的影响因素是温度、pH值、络合剂种类及其浓度。Aluminum Nitride Ceramics are metalized by electroless Ni-P plating. The metallization process has also been studied. The results show that good adhesion obtained between AIN ceramics and Ni-P film. In addition, the rate of plating is also increased, which is helpful to decrease production cost.

关 键 词：化学镀 强度 氮化铝陶瓷 电镀 镀合金 磷镍合金 

分 类 号：TQ174.758[化学工程—陶瓷工业] TQ153.2[化学工程—硅酸盐工业]