化学沉积法制备高分子复合导电微球  

Investigation of Polymer Composite Conductive Microsphere preparation By Electroless Plating

作　　者：高俊丽[1] 王为[1] 王慧[1] 郭鹤桐[1] 

机构地区：[1]天津大学

出　　处：《电镀与精饰》1998年第4期1-3,共3页Plating & Finishing

摘　　要：研究了聚苯乙烯微球表面化学沉积铜的速度及其影响因素，确定了最佳工艺参数。ＳＥＭ分析表明，本工艺制得的微球表面铜沉积层厚度均匀，与基体间结合牢固。微球本身具有很好的导电性。The deposition rate of copper on the surface of polystyrene microsphere and related factors have been investigated, and the optimum technique was determined. SEM analyses shown that the copper film made by the technique on the surface of the microsphere is uniform, and its adhesion with the matrix material is strong. The microsphere covered with copper film has very good conductivity.

关 键 词：导电微球 化学沉积 高分子复合材料 聚苯乙烯 

分 类 号：TQ325.206[化学工程—合成树脂塑料工业]