方柱微结构表面上FC-72的流动沸腾强化换热实验研究  

ENHANCED FLOW BOILING HEAT TRANSFER OF FC-72 ON MICRO-PIN-FINNED SILICON SURFACES

作　　者：马爱香[1] 魏进家[1] 袁敏哲[1] 方嘉宾[1] 

机构地区：[1]西安交通大学动力工程多相流国家重点实验室,陕西西安710049

出　　处：《工程热物理学报》2009年第8期1324-1326,共3页Journal of Engineering Thermophysics

基　　金：国家重点基础研究发展资助项目(No.2006CB601203);教育部新世纪优秀人才计划项目(No.NCET-07-0680);教育部科学技术研究重点项目(No.106142)

摘　　要：为了提高电子器件的冷却效率,研究了不导电介质FC-72在表面加工有方柱微结构的模拟芯片上的流动沸腾强化换热性能。采用了两种方柱微结构,其边长均为30μm,但高度分别为60μm和120μm。方柱微结构芯片与光滑芯片相比显示出较好的强化沸腾换热效果,且增加方柱高度可有效提高流动沸腾强化换热性能。方柱微结构芯片的临界热流密度随着流速和过冷度的增大而增大,且到达临界热流密度(CHF)时芯片的表面温度低于芯片回路正常工作的上限温度85℃。For efficiently cooling electronic components, the flow boiling neat transfer perfermance of FC-72 on micro-pin-finned silicon chips were studied. Two kinds of micro-pin-fins were used, which have the same fin thickness of 30 μm but different fin heights of 60 and 120 μm, respectively. The boiling heat transfer performance was much better for the micro-pin-fined surfaces than that for a smooth surface, and increased with increasing fin height. The critical heat flux increased with fluid velocity and subcooling, and the wall temperatures at the critical heat flux for micro-pin-finned chips were less than the upper temperature limit for the normal operation of electronic components, 85℃.

关 键 词：流动沸腾 芯片冷却 方柱微结构 FC-72 

分 类 号：TQ051.5[化学工程]