纳米结构强化的新型Sn-Ag基无铅复合钎料  

Research of New Sn-Ag Based Lead-free Composite Solders Containing Nano-structured Reinforcements

作　　者：刘彬[1] 邰枫[1] 郭福[1] 夏志东[1] 史耀武[1] 

机构地区：[1]北京工业大学材料科学与工程学院电子组装研究与测试中心,北京100124

出　　处：《材料工程》2009年第8期38-42,48,共6页Journal of Materials Engineering

基　　金：北京市科技新星计划B类资助项目(2004B03);霍英东基金资助项目(104016)

摘　　要：通过外加法向Sn-3.5Ag钎料中加入质量分数为1%,2%和3%的纳米级多面齐聚倍半硅氧烷(polyhedral oligomeric silsesquioxanes,POSS)颗粒制备无铅复合钎料。系统研究POSS颗粒的显微组织,钎料的熔化特性、润湿性能和力学性能。结果表明:POSS颗粒的加入并没有改变Sn-Ag基复合钎料熔化温度。复合钎料的铺展面积均有所增加,润湿角有所下降,表现了良好的润湿性。POSS颗粒的加入显著提高钎料钎焊接头的剪切强度。Composite solders were fabricated by mechanically mixing the Sn-3.5Ag solder paste with nano-seale of 1% （mass fraction）, 2% and 3% polyhedral oligomeric silsesquioxanes （POSS） particles. POSS microstrueture, melting characteristic,wetting property and shear strength were investigated. The results showed that the POSS particle didn＇t change the melting temperature of composite solders. Addition of POSS in the Sn-3. 5Ag solder increased the spreading area and decreased the contact angle of lead-free composite solder. Shear strength of POSS particle reinforced composite solder joints were improved remarkably.

关 键 词：POSS增强颗粒 熔化特性 润湿性 力学性能 

分 类 号：TG425[金属学及工艺—焊接]