小体积化学镀镍工艺  

Electroless nickel plating process in small bulk plating solution

作　　者：胡睿[1] 张华明[1] 熊晓玲[1] 王关全[1] 杨玉青[1] 刘国平[1] 

机构地区：[1]中国工程物理研究院核物理与化学研究所,四川绵阳621900

出　　处：《电镀与涂饰》2009年第8期27-29,共3页Electroplating & Finishing

基　　金：中国工程物理研究院科学技术发展基金(2007A02001)

摘　　要：以尺寸不规则的Y1Cr18Ni9不锈钢片为基底,研究了在约2mL镀液的条件下,化学镀镍工艺中主盐与还原剂浓度之比、pH、反应时间及反应温度对镀层沉积速率的影响。结果表明:当c(Ni2+):c(H2PO2-)=0.75:1,pH为6,温度为77°C,反应2h的条件下,镀层沉积速率快,含镍量高于72%,且颗粒分布均匀、密实。The effects of concentration ratio of main salt and reducing agent, temperature, pH, and reaction time on the deposition rate of electroless nickel on irregular-shaped Y1CrlSNi9 stainless steel substrate in a ca. 2 mL plating bath were studied. The results showed that the deposition is fast under the conditions of Ni^2＋ to H2PO2 concentration ratio 0.75：1, temperature 77 ℃, pH 6 and reaction time 2 h. The electrolessly deposited nickel coating is uniform and compact with a nickel content exceeding 72%.

关 键 词：不锈钢 化学镀镍 酸度 沉积速率 

分 类 号：TQ153.12[化学工程—电化学工业]