电路板化学镀镍液EN-600的研制  

Development of Electroless Nickel Plating Bath EN-600 for PCBs

作　　者：高敏[1] 陆云[1] 

机构地区：[1]广东省化学工业公共实验室广东省石油化工研究院,广东广州510665

出　　处：《广东化工》2009年第8期33-33,69,70,共3页Guangdong Chemical Industry

摘　　要：文章介绍一种用于电路板化学镀镍/沉金工艺的化学镀镍液EN-600。这种处理液采用独特的稳定体系,使镀液性能在寿命周期内保持稳定一致,同时能形成致密的镍磷合金层,增强镀层的耐蚀性,减少镍表面的过腐蚀,提高化学镀镍/沉金处理的良品率。The paper introduced a electroless nickel plating solution EN-600 for electroless nickel/immersion gold（ENIG） process in printed circuit boards. A special stabilizer system was introduced that allowed consistent performance during the entire bath life. EN-600 could deposit denser Ni-P alloy layer with improved corrosion resistance, reduce hyperactive corrosion of the nickel surface and improve ENIG process yields.

关 键 词：化学镀镍 化学镀金 稳定剂 过度腐蚀 

分 类 号：TQ153.12[化学工程—电化学工业] TN405[电子电信—微电子学与固体电子学]