Sn-Bi无铅焊料的研究  

Research of Sn-Bi Lead-free Solder

作　　者：胡丽[1] 曾明[1] 沈保罗[2] 

机构地区：[1]西华大学材料科学与工程学院,四川成都610039 [2]四川大学材料科学与工程学院,四川成都610065

出　　处：《现代电子技术》2009年第16期164-166,共3页Modern Electronics Technique

基　　金：四川省教育厅重点培养基金资助项目(07ZZ033)

摘　　要：通过总结传统Sn-Pb焊料的特点和研制无铅焊料的条件,综述Sn-Bi无铅焊料低熔点等优点以及脆性大、易偏析的缺点,分析添加In,Ag,Al,Sb等微量合金元素对Sn-Bi无铅焊料微观组织及性能的影响,提出了此合金系焊料的抗蠕变性、导电性、润湿性、拉伸性能等尚待完善的性能及可采用合金化、开发新型焊剂等新方法使Sn-Bi焊料成为理想的无铅焊料,为无铅焊料的进一步研究提供一定的参考。By summarizing up the characteristics of conventional Sn- Pb solder and the conditions for the development of lead - free solder,overviewing the advantages such as low melting point and disadvantages such as high brittleness,easy segregation of Sn- Bi lead -free solder, and analyzing the effects of trace alloying elements such as In, Ag, AI, Sb on the microstructure and properties of Sn- Bi solder. The performance as creep resistance, conductibility, wetting, extensibility which yet to be perfected of this solder and the new methods such as alloying, exploiting new flux which can be used so that make Sn- Bi solder become ideal lead - free solder are put forward. Providing reference for further study of lead - free solder.

关 键 词：Sn—Bi无铅焊料 合金元素 组织性能 合金化 

分 类 号：TG425[金属学及工艺—焊接]