基于TASPCB的PCB热分析、热设计技术探讨  

Study on the TASPCB-based Thermal Analysis and Thermal Design of PCBs

作　　者：毕锦栋[1] 张三娣[1] 郑丽香[1] 

机构地区：[1]工业和信息化部电子第五研究所,广东广州510610

出　　处：《电子产品可靠性与环境试验》2009年第4期42-48,共7页Electronic Product Reliability and Environmental Testing

摘　　要：简要地介绍了电子产品热分析、热设计的重要性及其方法的发展。重点介绍基于TASPCB环境下的电子元器件热模型的建立方法和电子元器件热功耗评估技术,并给出典型PCB热设计的实例,提出电子产品PCB设计的热设计优化措施。In this paper, the importance and advances of thermal analysis and thermal design of electronics were generally introduced. The thermal modeling and dissipation evaluation of electronic components based on TASPCB environment were presented in detail. A typical example for PCB thermal design was given, and the measures for optimizing the thermal design of PCBs were offered.

关 键 词：印刷电路板 热模型 热功耗 热设计 

分 类 号：TN41[电子电信—微电子学与固体电子学]