某密闭电子设备的热设计  

Thermal Design of Some Sealed Electronic Cabinet

作　　者：李增辰[1] 褚俐[2] 

机构地区：[1]中国电子科技集团公司第54研究所,河北石家庄050081 [2]石家庄职业技术学院,河北石家庄050081

出　　处：《电子机械工程》2009年第4期7-9,53,共4页Electro-Mechanical Engineering

摘　　要：介绍了电子设备热设计的基本内容,阐述了应用热分析软件的设计流程。采用Icepak软件对某密闭电子设备的原始设计进行了热仿真,从结果中找出了关键发热器件和影响散热的薄弱环节。通过调整关键发热器件的散热方式和机箱的整体散热结构,对密闭电子设备的结构进行了优化,使其满足了热设计要求。Based on the basic knowledge of thermal design of the electronic equipment, this paper explains the process of using heat analysis software. Through using the software of Icepak, a thermal simulation of the original design of the sealed electronic cabinet is made, in which the key weak parts of heating on devices and the causes which affect the cooling are found. Besides, the cooling modes of the key parts of heating and the whole heat dissipation structure are adjusted, so that the structure of the sealed electronic cabinet is optimized, and the demand to thermal design be met.

关 键 词：密闭机箱 热设计 仿真 优化设计 

分 类 号：TK124[动力工程及工程热物理—工程热物理]