SnAgCu系无铅钎料合金力学性能及钎焊性能研究  

Study on Mechanical Property and Solder ability of SnAgCu System Lead-free Solder Alloy

作　　者：许天旱[1,2] 金志浩[2] 王党会[1] 

机构地区：[1]西安石油大学,陕西西安710065 [2]西安交通大学,陕西西安710049

出　　处：《稀有金属材料与工程》2009年第8期1462-1466,共5页Rare Metal Materials and Engineering

基　　金：西安石油大学陕西省材料加工工程重点学科项目;西安石油大学青年基金(2005-47)

摘　　要：利用光学显微镜、扫描电子显微镜(SEM)和能谱分析仪(EDX)及Instron电液伺服疲劳拉伸试验机,对SnAgCu系无铅钎料合金的力学性能和钎焊性能进行了研究。结果表明,适量的稀土元素Ce的添加显著地延长了Sn3Ag2.8Cu钎焊接头在室温下的蠕变断裂寿命,Sn3Ag2.8Cu-0.1Ce钎焊接头的蠕变断裂寿命超过Sn3Ag2.8Cu钎料的9倍;同时,使Sn3Ag2.8Cu合金的延伸性能也得到了显著改善,伸长率达到15.7%;Sn3Ag2.8Cu-0.1Ce与铜基板的扩散层厚度比Sn37Pb厚,但是比Sn3Ag2.8Cu薄。The mechanical property and solder ability of SnAgCu system lead-free solder alloys were studied by means of optical microscopy, scanning electron microscopy（SEM）, energy dispersive X-ray（EDX） and Instron electrohydraulic servo fatigue tensile tester. The results indicate that proper quantities of Ce can remarkably prolong the creep-rupture life of the Sn3Ag2.8Cu brazing joint at room temperature, and the creep-rupture life of the Sn3Ag2.8Cu-0.1Ce brazing joint is 9 times or more than that of the Sn3Ag2.8Cu; meanwhile, the elongation of the Sn3.0Ag2.8Cu-0.1Ce solder alloy is also obviously improved even up to 15.7%; the intermetallic layers of the Sn3Ag2.8Cu-0.1Ce with copper plate are thicker than that of Sn37Pb, but thinner than that of Sn3Ag2.SCu.

关 键 词：SnAgCu系 无铅钎料合金 拉伸性能 蠕变断裂寿命 钎焊性能 

分 类 号：TG407[金属学及工艺—焊接]