电磁带隙结构的应用——PCB中电源接地层构造的EMI低减  

EMI Reduction from Power Bus Structures in PCBs Using EBG Structure

作　　者：李杰[1] 卞正才[1] 王志良[1] 

机构地区：[1]复旦大学信息科学与工程学院通信科学与工程系,上海200433

出　　处：《微波学报》2009年第4期33-36,77,共5页Journal of Microwaves

基　　金：国家自然科学基金资助(60571051)

摘　　要：在印制电路板的设计中,供电系阻抗谐振所引起的噪声和电磁干扰问题一直是设计人员关注的焦点。而电磁带隙结构(EBG)是一种由介质、金属或其混合体单元按周期性排列所构成的阵列结构,对特定频段内的电磁波呈现带阻特性。因此适当的EBG结构可以降低供电系阻抗、减少谐振峰的个数,从而有效地减轻供电系的电磁干扰问题。文中综合运用基于腔模模型的快速算法和分解元法计算了由两种不同介质材料组合构成的EBG结构对供电系阻抗特性的影响。旨在说明EBG对EMI低减的作用和贡献。Power bus noise problem and EM interference （EMI） problem caused by resonant impedances have become a major concem for EMC engineers engaged in PCB design. However, Electromagnetic Band-Gap （EBG） is an array structure periodically arranged by the dielectric, metal or combination of them. The use of the proper EBG structure can reduce not only the magnitude of the transfer impedances but also the number of the resonance peaks, thus contribute to the EMI reduction of the power bus. In this paper, the fast algorithm based on the cavity-mode model is combined with the segmentation method to calculate the impedance characteristic of a power bus whose dielectric layer is an EBG structure composed of two different dielectric materials. It is shown that EBG structure can significantly contribute to the EMI reduction.

关 键 词：印制电路板 电磁带隙结构 腔模模型 供电系阻抗快速算法 分解元法 

分 类 号：TN41[电子电信—微电子学与固体电子学]