钢铁件直接焦磷酸盐镀铜工艺研究  

Investigation on Direct Copper Plating Technology of Steel Workpieces in Pyrophosphate Bath

作　　者：郭崇武 易胜飞 

机构地区：[1]肇庆市华良金属精饰制品有限公司,广东肇庆526105

出　　处：《电镀与精饰》2009年第8期11-14,共4页Plating & Finishing

摘　　要：依据电位活化理论，研究了超低浓度焦磷酸铜预镀铜电解液，其组成为：0．5～2．5g/L焦磷酸铜，150-200g／L焦磷酸钾。在该电解液中的阴极钢铁件主要发生水的电解反应，同时，工件表面的氧化膜被还原。经过上述处理后，工件表面镀上一层铜膜，然后按常规焦磷酸盐工艺镀铜。实验表明。镀层与基体的结合力与钢铁件氰化镀铜大体相同。An ultra-low concentration copper pyrophosphate electrolyte for preliminary copper plating, which contained 0.5-2.5 g/L Cu2P2O7·3H2O and 150-200 g/L K4P2O7·3H2O, was researched according to the potential activation theory. A water electrolysis reaction was took place on the cathodic steel workpiece, and the oxide film on the steel workpiece surface was reduced. Treated by above process, the workpiece was coated with a copper film and then could be copper plated with conventional pyrophosphate copper-plating bath. The tests show that the bonding strength of the eleetroplating layer on steel substrate is similar to that of cyanide copper plating on steel surface.

关 键 词：电位活化 钢铁件 超低浓度 焦磷酸铜 预镀铜 

分 类 号：TQ153.14[化学工程—电化学工业]