电力电子集成模块用平板热管的传热研究  

Thermal Characteristic of a Novel Flat Plate Heat Pipe for Hybrid Integrated Power Electronic Module

作　　者：张良华[1] 余小玲[2] 杨旭[1] 周恩民[2] 冯全科[2] 王兆安[1] 

机构地区：[1]西安交通大学电气工程学院,陕西西安710049 [2]西安交通大学能源与动力工程学院,陕西西安710049

出　　处：《电子学报》2009年第8期1848-1853,共6页Acta Electronica Sinica

基　　金：国家自然科学基金(No.50237030);台达资助项目(No.DRE02006001)

摘　　要：为了解决高封装密度的电力电子集成模块所面临的热集中问题,本文提出了一种在蒸发端和冷凝端设置有工质回流柱的垂直传热平板热管用以替代传统电力电子集成模块的纯铜基板,并对该模块的传热性能进行了研究.研究结果表明,在186W/cm^2的热载荷下,热管基板蒸发端的高对流换热系数削弱了模块的热集中现象,其结壳热阻是商用铜基板模块热阻的一半,并且热管基板在正反放置的情况下具有相同的散热性能.集成模块在225W的脉宽热载荷冲击下,管芯的瞬态最高温度比商用模块低46℃.This paper presents a novel fiat heat pipe filled with negative-ion water to take the place of copper heat spreader of commercial power electronic module to solve the issues of heat concentration. With increasing of dissipated power on the die,the heat transfer coefficient on evaporator increases,and then the thermal flux density vector transfers from heat source to the evaporator vertically. In the conditon of 186W/cm^2 thermal load, the junction-to-case （JC） thermal resistance descreases to the half of commercial power module. The dynamic performance shows that the chip temperature is lower 46℃ than that of commercial module using 3mm copper heat spreader with 225W pulse thermal load and forced air cooling heat sink.

关 键 词：平板热管 电力电子集成模块 传热特性 热路模型 

分 类 号：TK124[动力工程及工程热物理—工程热物理]