高固相率SiC_P/AZ61复合材料触变成形的数值模拟  

Numerical Simulation of Thixoforming of SiC_P/AZ61 Composites under High Solid Volume Fraction

作　　者：张发云[1] 闫洪[2] 

机构地区：[1]新余高等专科学校太阳能科学与工程系,江西新余338031 [2]南昌大学先进成形制造及模具研究所,江西南昌330029

出　　处：《铸造技术》2009年第8期1050-1053,共4页Foundry Technology

基　　金：国家自然科学基金(50465003;50765005);江西省自然科学基金(2007GZC1826);江西省教育厅资助项目

摘　　要：采用等温热处理法制备SiCP/AZ61复合材料半固态坯料,在自制实验装置上进行触变成形实验。采用所建立的高固相率SiCP/AZ61复合材料本构模型,对触变成形过程进行了数值模拟,得到了不同成形温度下的应力、应变和温度场分布。结果表明,与成形温度为530℃相比,560℃时复合材料触变成形具有变形抗力小、应变与温度场分布均匀的特点。通过实验和模拟结果对比可知(成形温度为560℃),两者吻合较好,所获结果可指导高固相率镁基复合材料触变成形工艺实践。Semi-solid specimen of SiCP/AZ61 composites was fabricated by semi-solid isothermal heat-treatment. The experiment of thixoforming was carried out on the self-made device. The constitutive model of SiCP/AZ61 composites under high solid volume fraction was established in our prior literature. The thixoforming processes of SiCP/AZ61 composites was studied by numerical simulation, and the distribution of stress, strain and temperature have been obtained under different deforming temperature. The results indicated that thixoforming of SiCP/AZ61 composites at 560 ℃ had some advantages just like small loads, small stress and well-proportioned strain and temperatures over thixoforming of SiCP/AZ61 composites at 530 ℃. Numerical simulation results were accorded with experimental ones, which provided for the practice production of SiCP/AZ61 composites under high solid volume fraction as theory bases.

关 键 词：SiCP/AZ61复合材料 半固态 触变成形 数值模拟 

分 类 号：TG29[金属学及工艺—铸造]