液固包覆法制备Al-Pb层状复合材料及其界面研究  

Study on interface of Al-Pb composite prepared by liquid-solid coating method

作　　者：竺培显[1] 周生刚[1,2] 孙勇[2] 黄文芳[1] 杨秀琴[1] 许健[1] 张瑾[1] 

机构地区：[1]昆明理工大学材料与冶金工程学院,云南昆明650093 [2]昆明理工大学稀贵及有色金属先进材料教育部重点实验室,云南昆明650093

出　　处：《材料热处理学报》2009年第4期1-5,共5页Transactions of Materials and Heat Treatment

基　　金：国家自然科学基金资助项目(50664005);国家高技术研究发展计划(863)项目(2009AA03Z512)

摘　　要：利用键参数函数理论分析了第三组元Bi或Sn作为Al-Pb非混溶体系实现冶金结合一体化的可行性,并采用液-固包覆成型的方法制得了Al-Bi-Pb及Al-Sn-Pb层状复合材料,通过SEM、EDS等检测手段分析研究试样的显微组织,并讨论了界面的扩散现象。结果表明:第三组元Bi或Sn的引入将Al、Pb的混合焓ΔHmin降低到零以下,在扩散动力学作用驱使下使各元素间在界面处发生了迁移和互扩散,形成了成分调控区,表现为一条状的均质固溶体带,实现了Al与Pb之间的冶金结合。The possibility to improve the bonding of Al-Pb interface with taking Bi or Sn as the third element in the interface was analyzed by function of bonding parameters,and the layered composite materials of Al-Bi-Pb and Al-Sn-Pb were prepared by liquid-solid coating method.Microstructure of the layered composite materials were examined by SEM and EDS.The results show that introducing of Bi or Sn reduces the ΔH（min） of Al/Pb system to be negtive,and inter-diffusion of elements in the interface region occurs, and a metallurgical bonding interface between Pb and A1 forms.

关 键 词：层状复合材料 键参数函数 Al-Pb非混溶体系 

分 类 号：TG113.12[金属学及工艺—物理冶金] TB331[金属学及工艺—金属学]