提高复合电镀陶瓷与金属钎焊接头强度的方法  

A Method of Improving Brazing Joint Strength of Plated Ceramic to Metal

作　　者：张永清[1] 阴生毅[1] 郑晓阳[1] 李玉竹[1] 

机构地区：[1]中国科学院电子学研究所高功率微波源与技术重点实验室,北京100190

出　　处：《真空电子技术》2009年第4期22-26,共5页Vacuum Electronics

摘　　要：为进一步提高复合电镀Ni-Ti陶瓷与金属钎焊接头的强度，提出了一种两步法的新方法。这一方法辉光扩散在先，钎焊在后。研究表明，采用这一方法，镀膜陶瓷钎焊接头的强度达到232-256MPa。强度显著提高的原因在于辉光扩散使得Ni—Ti镀层中的Ti原子在陶瓷界面形成了明显的富集。In order to forward improving brazing joint strength of Ni Ti compound plated ceramic to metal, a new two-step method was developed. In this method, the glow discharge diffusion went first, and the brazing the second. The research indicated that the strength of the plated ceramic joint reached 232-256 MPa, and the reason for remarkable strength raise is that the glow discharge diffusion enabled Ti atoms in Ni-Ti layer diffuse and form rich collection at ceramic interface.

关 键 词：陶瓷 钎焊 NI-TI 辉光扩散 

分 类 号：TG454[金属学及工艺—焊接]