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机构地区:[1]天津大学材料学院,天津300072
出 处:《真空电子技术》2009年第4期85-87,90,共4页Vacuum Electronics
摘 要:针对两种ZrO2增韧陶瓷的微波连接,开展了对连接界面特性的一系列研究,包括连接实验参数、界面的显微结构、界面元素的扩散情况等,并取得了初步的研究成果。实验结果表明:实验参数,包括基体的制备方法、连接相浆料的固相含量、升温制度等,均对连接界面产生显著影响;基体和连接相的元素在连接界面处发生一定的互扩散是形成良好连接界面的基础。连接试样均在1000~3000W低功率下实现成功连接,用时较短,体现了微波连接节能省时的优点。A series of study was conducted on the microwave joint interface of two kind of ZrO2 toughened ceramic, including joint experiment parameter, microstructure of joint interface, interracial element diffusion and so on. The results showed: the experiment parameter, including the preparation method of base material, the content of solid state material in the lurry interlayer, the heating process and so on, could make important impact on the joint interface; the inter-diffusion of elements between base material and the interlayer was the base of fine joint result. The joining processes were successfully conducted under low energy of 1000 W to 3000 W in short time, indicating the advantage of microwave joining on time and energy reduce.
关 键 词:微波连接 ZTM ZTA 连接界面 显微结构 扩散情况
分 类 号:TQ174.758[化学工程—陶瓷工业] TP368.32[化学工程—硅酸盐工业]
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