退火对熔体旋甩p型Bi_2Te_3薄带微结构的影响  

Influence of Anneal Process on the Microstructure of p-type Bi_2Te_3 Ribbons Prepared by Melt Spinning Technique

作　　者：金桥[1] 谢文杰[1] 陈果[1] 唐新峰[1] 

机构地区：[1]武汉理工大学材料复合新技术国家重点实验室,武汉430070

出　　处：《武汉理工大学学报》2009年第17期18-20,共3页Journal of Wuhan University of Technology

基　　金：国家"973"计划(2007CB607501)

摘　　要：采用单辊熔体旋甩法制备出p型Bi2Te3薄带,研究了退火温度和时间对p型Bi2Te3薄带微结构的影响。结果表明,薄带自由面和接触面的形貌和晶粒尺寸,经过退火处理都发生了变化。当退火温度低于200℃时,退火温度和时间对薄带自由面和接触面的微结构没有明显影响;当退火温度为300℃时,薄带自由面枝状晶和接触面等轴状晶明显长大,且在此温度下,随着退火时间的延长,晶粒进一步长大。P-type Bi2Te3 ribbons are prepared by melt spinning method. The influence of anneal temperature and anneal time on the microstructure of ribbons are investigated. The result shows that the morphology and grain size of both free surface and contact surface changed after anneal process. When anneal temperature is lower than 200℃, anneal temperature and anneal time have no apparent influence on the microstructure of ribbons; however, when anneal temperature is 300℃, the dendrite grains of free surface and equiaxed grains of contact surface grow apparently. And under this temperature, the grains grow up after long time anneal.

关 键 词：P型Bi2Te3 熔体旋甩 退火 微结构 

分 类 号：TN37[电子电信—物理电子学]