铅板无氰仿金镀工艺研究  

Study on Cyanide-free Imitation Gold Plating Technology of Lead Plate

作　　者：徐炳辉[1] 张艳[1] 孙雅茹[1] 张春艳[1] 

机构地区：[1]沈阳工业大学理学院,辽宁沈阳110178

出　　处：《电镀与精饰》2009年第9期36-39,共4页Plating & Finishing

摘　　要：用扫描电镜和能谱分析方法，研究了铅板上仿金镀层组成颜色及表面形貌，确定了铅板上仿金电镀的工艺流程及最佳工艺参数。结果表明，以光亮镀镍打底，仿金镀的Jk=1．2A／dm^2；pH=8．5～9．3；θ=20～35℃；t=1～4min的条件下，能够获得仿金色镀层，且镀层表面平整，结晶细致，无裂痕、孔隙，镀层质量较好。The application of imitation gold electroplating technology to lead plate was studied. The effects of various factors including the electric current density, bath temperature, plating times and bath pH val- ue on surface color, metal element contents and surface morphology of the coating were investigated using scanning electronic microscope and energy analysis spectrometer. The results show that pretreatment of bright nickel plating is necessary for increasing the surface brightness and hardness of the coating; when the electric current density is 1.2 A/dm^2 , bath pH value is 8.5-9.3, bath temperature is within 20 -35℃ , plating time is in 1-4 minute, a golden color coating with bright and smooth surface can be produced.

关 键 词：铅板 仿金镀 电流密度 PH 

分 类 号：TQ153.18[化学工程—电化学工业]