超轻薄优盘注塑成型过程有限元分析  

The Finite Element Analysis of Injection Molding Process for Ultra-thin USB

作　　者：秦升学[1] 鲁广友[1] 任莉新[1] 徐旭 

机构地区：[1]山东科技大学机电学院,山东青岛266510 [2]青岛精研精密模具有限公司,山东青岛266228

出　　处：《塑料科技》2009年第9期55-57,共3页Plastics Science and Technology

基　　金：山东省自然科学基金资助项目(Y2007F59)

摘　　要：本研究利用有限元分析软件Moldflow,对超轻薄优盘的注塑成型过程进行了模拟分析,预测了塑件的最佳浇口位置、浇注系统的平衡性、熔接痕的强度、冷却系统的冷却效果以及塑件的翘曲情况。针对分析中出现的问题,提出了相应的优化方案。在此基础上,开展了模具的制造,取得了满意的效果。本研究对同类产品的精密注塑模具设计具有一定的指导作用和参考价值。The molding process of the ultra-thin USB was analyzed and simulated through finite element software Moldflow. The main factors were predicted,such as the best gate location of the part,the balance of the gating system,the strength of weld marks,the effect of the cooling system and the warping deformation of the part. In order to overcome the problems existing in the simulation,the corresponding optimization programs were proposed. The mold were made on this basis,and the results were well. This study served as a guiding role for the products of the design of same type of precise injection mold,

关 键 词：多型腔 塑料 精密注塑 有限元 模拟 

分 类 号：TQ320.662[化学工程—合成树脂塑料工业]