TC4/Ni/ZQSn10-2-3扩散连接  

Study on diffusion bonding TC4 to ZQSn10-2-3 using a Ni interlayer

作　　者：赵贺[1] 曹健[1] 冯吉才[1] 

机构地区：[1]哈尔滨工业大学现代焊接生产技术国家重点实验室,哈尔滨150001

出　　处：《焊接学报》2009年第9期61-64,共4页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(50805038;50375065)

摘　　要：采用镍箔做中间层,在真空下对TC4和ZQSn10-2-3进行扩散连接.使用扫描电镜对接头的界面组织进行了研究.确定TC4/Ni/ZQSn10-2-3接头的界面结构是TC4/β-Ti/Ti2Ni/TiNi/TiNi3/Ni/Cu(Cu,Ni)/ZQSn10-2-3.通过最优工艺试验,确定最佳工艺参数为连接温度830℃,连接压力10MPa,连接时间30min.此时接头最大抗剪强度为135MPa,接头断口为带有一定塑性的结晶状形貌.通过X射线衍射对断口分析认为,断裂位于TC4/Ni界面处的金属间化合物TiNi3层.Diffusion bonded joints were prepared between TC4 and ZQSn10-2-3 with nickel as an interlayer in vacuum.The microstructure of transition joints was investigated by scanning electron microscope and energy dispersive spectrometry.The typical interface of TC4/Ni/ZQSn 10-2-3 joint is TC4/β-Ti/Ti2Ni/TiNi/TiNi3/Ni/Cu(Cu,Ni)/ZQSn10-2-3.The optimum parameters were obtained in the condition of 830 ℃ for 30 min under 10 MPa by optimum experiments.The maximum shear strength was 130 MPa.The results showed the fracture was crystal morphology with a little plastic,and occurred proximity to TiNi3 intermetallic layer in TC4/Ni side through X-ray diffraction analysis.

关 键 词：钛合金 锡青铜 扩散连接 镍箔 金属间化合物 

分 类 号：TG457.1[金属学及工艺—焊接]