热浸涂银/氯化银参比电极性能研究  

PERFORMANCE OF Ag/AgCl REFERENCE ELECTRODE PREPARED BY HOT DIP COATING METHOD

作　　者：何霖[1] 许立坤[1] 王均涛[1] 尹鹏飞[1] 

机构地区：[1]中船重工七二五所青岛分部海洋腐蚀与防护国防科技重点实验室,青岛266071

出　　处：《腐蚀科学与防护技术》2009年第5期482-485,共4页Corrosion Science and Protection Technology

摘　　要：使用热浸涂法制备了银/氯化银(Ag/AgCl)参比电极.通过SEM和EDX对电极表面的形貌和成分分析发现,在AgCl晶界的交界处易被优先还原.XRD分析表明,浸涂温度升高,Ag/AgCl电极的晶粒尺寸变小.电化学性能测试表明,热浸涂Ag/AgCl电极具有良好的电位稳定性;随着浸涂温度的升高,Ag/AgCl电极的极化电阻减小,双电层电容增大,比表面积增大,耐极化性能有所提高.Ag/AgCl reference electrodes were prepared by hot dip coating mothed. The morphology and composition were examined with SEM and EDX, showing that the AgCl is reduced into silver preferentially on the boundary juncture. The XRD patterns indicate that the grain size of the electrode decreases with the rising of the hot dip temperature. The electrochemical tests demonstrate that the Ag/AgCl reference electrodes prepared by hot dip coating mothed exhibit a high potential stability. With the rising hot dip temperature,the polarization resistance of the Ag/AgCl electrode will decrease, the double layer capacity will increase and the specific surface area will enlarge, resulting in the improvement of the electrode performance.

关 键 词：参比电极 银/氯化银 热浸涂 

分 类 号：TG174.3[金属学及工艺—金属表面处理]