瞬时液相扩散连接在镍及镍基合金焊接中的应用  

Applications of transient liquid-phase bonding in nickel and nickel-base alloy welding

作　　者：王非森 陈思杰[2] 高增[2] 文申柳 陈玲[1] 

机构地区：[1]四川化工职业技术学院机电系,四川泸州646000 [2]河南理工大学材料科学与工程学院,河南焦作454000

出　　处：《电焊机》2009年第9期38-42,共5页Electric Welding Machine

摘　　要：针对镍及镍基合金在焊接过程中易出现热裂纹和气孔等问题,介绍了其瞬时液相扩散连接。叙述了瞬时液相扩散连接的理论、温度、压力和中间层等重要参数,分析了瞬时液相扩散连接镍及镍基合金在的优越性。描述了瞬时液相连接技术在镍及镍基合金焊接中的应用情况,并展望了瞬时液相连接技术的应用前景。Aiming at the gas cavity and crack are appeared regularly in nickel and nickel-base alloy welding process,this paper introduces the transient liquid-phase bonding technology of nickel and nickel-base alloy.The paper details major theory and parameter, and analyzed the superiority of nickel and nickel-base alloy on transient liquid-phase bonding,then introduced the transient liquid- phase bonding in nickel and nickel-base alloy welding process,and finally forecasted the nickel-base alloy on transient liquid-phase bonding.

关 键 词：镍及镍基合金 瞬时液相扩散连接(TLP) 优越性 

分 类 号：TG457.1[金属学及工艺—焊接]