基于ANSYS的活塞环激光热处理温度场计算及其实验研究  

ANSYS-based Numerical Calculation of Temperature Field During Laser Heat Treatment on Piston Ring and Experiment Research

作　　者：周春燕[1] 邓琦林[1] 高宾[1] 

机构地区：[1]上海交通大学机械与动力工程学院,上海200240

出　　处：《电加工与模具》2009年第5期39-43,共5页Electromachining & Mould

基　　金：国家自然科学基金资助项目(50675136)

摘　　要：应用有限元分析软件ANSYS计算了圆柱状模型活塞环环槽激光热处理的温度场,从环槽的边缘处开始,将截面上径向坐标每次减少0.1 mm,依次确定同一径向坐标处深度方向最大温升大于相变温度(AC1)的点,并用曲线将其连接起来近似硬化层的形状,在此基础上讨论了激光功率、扫描速度与形成硬化层深度的关系。将激光束偏转一定的角度照射到活塞环的环槽面上,转动工件来实现整个环面的热处理。根据硬化层和基体耐腐蚀性不同的特点腐蚀后显现出截面上硬化层的形状,测量沿硬化层宽度和深度方向的硬度值测定硬化层的尺寸。Temperature field during laser heat treatment on cylindrical model of piston ring groove is simulated by finite element analysis software ANSYS. The point of maximum temperature rise which is higher than phase change temperature（AC1） on section is plotted by a curve to simulate the shape of hardened layer. The relationships between the depth of hardened layer and laser power, scanning speed are discussed. The whole groove heat treatment is realized by laser beam revolving a certain angle and part＇s eircumvolving. The shape of hardened layer appears because the causticity resistance between the substrate and it is different. The dimension is measured by the value of rigidity of width and depth direction respectively.

关 键 词：激光热处理 活塞环 ANSYS 温度场 

分 类 号：TG156.99[金属学及工艺—热处理]