聚晶金刚石研磨工艺参数分析  

Analysis on Processing Parameter in Grinding of the Polycrystalline Diamond

作　　者：康凯敏[1] 叶书强[1] 曹凤国[1] 翟力军[1] 

机构地区：[1]北京市电加工研究所,北京100191

出　　处：《电加工与模具》2009年第5期53-56,共4页Electromachining & Mould

摘　　要：对聚晶金刚石(PCD)的研磨机理进行了初步探讨;分析了研磨粉粒度及用量、研磨速度及研磨轨迹、研磨压力等工艺参数对研磨效率和研磨质量的影响规律。Preliminary discussion on the lapping mechanism of the polycrystalline diamond is preformed. The influences of processing parameters such as particle size, the amount of grinding powder, speed of rotating of grinding plate, grinding track and grinding pressure on the grinding quality and efficiency are analyzed by large number of experiments.

关 键 词：聚晶金刚石 研磨机理 单面研磨机 工艺参数 

分 类 号：TG669[金属学及工艺—金属切削加工及机床]