单搭接胶接接头弹性应力的二维分析方法  

Elastic Stress Analysis of Single-Lap Adhesive-Bonded Joints

作　　者：赵波[1] 吕振华[1] 

机构地区：[1]清华大学,北京100084

出　　处：《应用力学学报》2009年第3期608-613,共6页Chinese Journal of Applied Mechanics

摘　　要：提出一种能得到单搭接胶接接头二维弹性应力解析解的的一般分析方法。该方法从纵向正应力沿厚度线性分布的理论假设出发,用完整的几何方程与本构方程,在考虑了被粘物与胶层的剪应力和剥离正应力沿厚度的变化,而且严格满足包括搭接区端头胶层剪应力为零的所有边界条件下,能够准确地预测接头任意点的应力状态,并适用于被粘物/胶层几何和材料属性的任何组合。通过与以往的解析解和有限元分析结果对比表明:不仅胶层平均剪应力最大值发生在距胶层端头很近的位置处,而且平均剥离正应力最大值位置也距离接头端头很近。这与以往绝大多数理论解预测"胶层剪应力和剥离正应力最大值都发生在端头处"的结论不同;该解析解有很好的精度和较广的适用范围。A unified approach with the closed-form analytical solutions is purposed for elastic stress analyses of a single-lap adhesive-bonded joint. The variation of shear and peel stresses across the joint thickness is predicted by the complete strain-displacement and stress-strain equations for both adhesive and adherends. The linear distribution assumption of a longitudinal normal stress in the joint thickness direction leads to quadratic shear stress, and cubic peel stress distributions through the thickness of the adherends/adhesive-layer. The approach is adaptable for any possible adhesive layer flexibility and capable of satisfying all the boundary conditions of stress equilibrium in the joint, including the zero shear stress condition at the ends of the adhesive layer. Satisfactory comparisons with previously analytical solutions and finite element results are presented. It is shown that the average peel stress of the adhesive layer predicted with the proposed theory, similar to the average shear stress, reaches its maximum values at a very small distance from the free adhesive edges. This is a remarkable difference from the previous G-R type models, where the maximum shear and peel stresses are predicted to occur at both ends of the overlap region.

关 键 词：单搭接胶接接头 应力分析 二维弹性分析 边界条件 

分 类 号：TG498[金属学及工艺—焊接]