用DSC和TG方法研究钼酚醛树脂的固化反应及动力学  

A Study on Curing Reaction and Its Kinetics of Mo-Phenolic Resins by DSC and TG

作　　者：华幼卿[1] 秦倩[1] 吴一弦[1] 

机构地区：[1]北京化工大学,北京100029

出　　处：《现代科学仪器》1998年第5期33-36,共4页Modern Scientific Instruments

摘　　要：采用DSC和TG方法研究了新型钼酚醛树脂的固化行为和固化反应动力学，用TG方法研究了固化产物的热降解性能，并进行了固化机理的探讨。结果表明，No．2钼酚醛树脂，当树脂泪化剂配比为100／10时，固化温度最低，固化反应表现活化能最小，产物的热稳定性能最佳，成炭率最高，其最大固化程度的温度为200℃。Curing behavior and curing reation kinetics of novel Mo - phenolic resins were studied by DSC and TG, ther-mal degradation properties of cured pnduct was studied by TG and mechanism of curing was explored by FTIR. The results show that No. 2 Mo- phenolic resin/curing agent (100/10) pments the lowest curing tempetature, smallest activation energy for cuting reation, excellent thermal stability and highest carbonation ratio. And the temperature for its largest curing extent is 200℃.

关 键 词：钼酚醛树脂 固化 热稳定性 DSC TG 酚醛树脂 

分 类 号：TQ323.1[化学工程—合成树脂塑料工业]