Numerical simulation of recalescence of 3-dimensional isothermal solidification for binary alloy using phase-field approach  

作　　者：朱昌盛 肖荣振 王智平 冯力 

机构地区：[1]Computer Aided Designed Center,Lanzhou University of Technology [2]State Key Laboratory of Gansu New Non-ferrous Metal Materials,Lanzhyou University of Technology

出　　处：《中国有色金属学会会刊：英文版》2009年第5期1286-1293,共8页Transactions of Nonferrous Metals Society of China

基　　金：Project(10964004)supported by the National Natural Science Foundation of China;Project(20070231001)supported by Research Fund for the Doctoral Program of Higher Education of China;Project(096RJZA104)supported by the Natural Science Foundation of Gansu Province,China;Project(SB14200801)supported by the Doctoral Fund of Lanzhou University of Technology

摘　　要：A accelerated arithmetic algorithm of the dynamic computing regions was designed,and 3-dimensional numerical simulation of isothermal solidification for a binary alloy was implemented.The dendritic growth and the recalescence of Ni-Cu binary alloy during the solidification at different cooling rates were investigated.The effects of cooling rate on dendritic patterns and microsegregation patterns were studied.The computed results indicate that,with the increment of the cooling rate,the dendritic growth velocity increases,both the main branch and side-branches become slender,the secondary dendrite arm spacing becomes smaller,the inadequate solute diffusion in solid aggravates,and the severity of microsegregation ahead of interface aggravates.At a higher cooling rate,the binary alloy presents recalescence;while the cooling rate is small,no recalescence occurs.A accelerated arithmetic algorithm of the dynamic computing regions was designed, and 3-dimensional numerical simulation of isothermal solidification for a binary alloy was implemented. The dendritic growth and the recalescence of Ni-Cu binary alloy during the solidification at different cooling rates were investigated. The effects of cooling rate on dendritic patterns and microsegregation patterns were studied. The computed results indicate that, with the increment of the cooling rate, the dendritic growth velocity increases, both the main branch and side-branches become slender, the secondary dendrite arm spacing becomes smaller, the inadequate solute diffusion in solid aggravates, and the severity of microsegregation ahead of interface aggravates. At a higher cooling rate, the binary alloy presents recalescence; while the cooling rate is small, no recalescence occurs.

关 键 词：二元合金 等温凝固 数值模拟 三维 冷却速度 二次枝晶间距 微观形态 算法设计 

分 类 号：TG111.4[金属学及工艺—物理冶金]