还原方法对热浸涂银/卤化银参比电极的影响  

Effect of Reduction Methods on Ag/AgX Reference Electrodes Prepared by Thermal Dip-coating Method

作　　者：尹鹏飞[1,2] 薛桂林 王均涛[2] 许立坤[2] 侯文涛[1] 

机构地区：[1]山东大学化学与化工学院,济南250100 [2]中国船舶重工集团公司第七二五研究所,海洋腐蚀与防护国防科技重点实验室,青岛266071

出　　处：《腐蚀与防护》2009年第10期697-700,共4页Corrosion & Protection

摘　　要：分别使用热浸涂-氢还原与热浸涂-电化学还原方法制备了银/卤化银(Ag/AgX)参比电极。采用SEM观察、电化学阻抗测量、耐极化性能测试等方法研究了参比电极的微观结构和电化学性能,结果表明,不同还原方法对电极性能有明显影响。电化学还原法制备的电极较氢还原法所制备的电极内阻小,比表面积大,耐极化性能好。不同还原法所制备的电极的电位稳定性和温度系数没有明显区别。Ag/AgX reference electrodes were prepared by thermal dip-coating with hydrogen reduction and electrochemical reduction method. The microstrueture and electrochemical performance were studied using SEM, EDX , EIS, and constant current polarization. The results show that the different reduction methods had obvious effect on the performance of the Ag/AgX electrodes. The electrode prepared by electrochemical reduction had smaller internal resistance, larger active surface area and better anti-polarization ability than the electrode by hydrogen reduction. But there was no obvious difference in the stability and temperature coefficient between the electrodes prepared by different reduction methods.

关 键 词：参比电极 银/卤化银 还原方法 

分 类 号：TG174.41[金属学及工艺—金属表面处理]