新型耐高温多层隔热结构研究  

New-type high-temperature multilayer insulation material

作　　者：李健芳[1] 何飞[1] 赫晓东[1] 

机构地区：[1]哈尔滨工业大学复合材料与结构研究所,哈尔滨150080

出　　处：《材料科学与工艺》2009年第4期531-534,共4页Materials Science and Technology

基　　金：中国博士后科学基金资助项目(20070420845);哈尔滨工业大学优秀青年教师培养计划资助(HITQNJS2007003)

摘　　要：为了改善传统应用的多层隔热材料的耐温及隔热效果等性能,以耐高温硅酸铝纤维纸和石英纤维网为基体材料,疏水性SiO2气凝胶颗粒为隔热填料,采用粘结工艺制备了新型耐高温多层隔热结构.采用石英灯阵列光电加热装置测试该结构冷面温度随时间的变化情况,采用PBD-02P平板导热仪测试各个指定温度下的导热系数,采用扫描电镜表征胶层的微观形貌.研究改变疏水性SiO2气凝胶颗粒添加量对导热系数的影响,结果表明,当疏水性SiO2气凝胶颗粒与耐高温胶粘剂质量比为2∶40时制备出的试样具有最低导热系数.这种新型耐高温多层隔热结构最高使用温度可达1000℃,平均密度小于0.25g/cm3,热面温度为1000℃时最佳配比试样的导热系数仅为0.080W/(m·K).该结构优异的综合性能能够很好地应用于航空航天隔热领域.In order to improve the performance of traditional temperature-resistant insulation materials, a new- type high-temperature multilayer insulation （MLI） material was developed by felting process using alumina silicate fiberpapers and silica fiber net as substrate, and hydrophobic silica aerogel granules as fillings. The temperature change of cold faces following time and the thermal conductivity coefficients at different temperatures were tested respectively by Quartz Lamp Heating Device and PBD -02P Table Thermal Conductor. SEM was used to figure the microstructure of glue. Analysis on the relationship between the quantity of fillings in the glue and the thermal conductivity coefficient shows that the sample has the lowest thermal conductivity coefficient when the ratio of hydrophobic silica aerogel granule to glue is 2： 40. The developed new-type high-temperature MLI can be used in the circumstance of 1000 ℃, and its density is less than 0. 25 g/cm^3. Its effec- tive thermal conductivity is 0. 080 W/（ m·K） at 1000 ℃. The developed material can be widely used in the fields of aeronautical and space technologies.

关 键 词：高温 多层隔热结构 SIO2气凝胶 热导率 

分 类 号：V19[航空宇航科学与技术—人机与环境工程]