超硬磨具用环氧树脂胶粘剂粘接强度影响因素的研究  

Study on influencing factors of epoxy resin bond strength used in superhard grinding wheels

作　　者：刘一波[1] 刘伟[1] 孙越邈[2] 徐晓伟[2] 黄盛林[1] 赵刚[1] 陈哲[1] 

机构地区：[1]钢铁研究总院,北京100081 [2]北京科技大学,北京100083

出　　处：《超硬材料工程》2009年第4期6-9,共4页Superhard Material Engineering

基　　金：北京市科委重大科技攻关计划项目经费支持(项目编号1101081422801(1-1))

摘　　要：研究了陶瓷结合剂超硬磨具用CH型环氧树脂胶粘剂固化比、温度和添加铜粉改性对胶粘剂粘接强度的影响。结果表明:A(环氧树脂)∶B(固化剂)的不同配比显著影响粘接强度,A∶B=2∶3或3∶2时,其强度达到最大。随温度上升,粘接强度逐渐下降,当温度上升到125℃时其粘接强度仍能达到10M Pa。添加铜粉改性后,胶粘剂粘接强度随着铜粉的增加先增加后下降,当铜粉含量为5w t%时,其强度最大,比不改性的胶粘剂粘接强度提高约25%。The effects of curing rate, temperature and copper powder addition of CH epoxy resin used in vitrified bond superhard abrasives grinding wheel on bond strength have been studied. The results show that the ratio of A （epoxy resin） to B （curing agent） has a great effect on the bond strength, which reaches the highest level When the ratio of A to B is 2 ： 3 or 3 ： 2. The bond strength decreases gradually along with the temperature increasing and it is about 10MPa at 125℃. With copper powder addition increasing, the bond strength firstly increases and then decreases. It can reach the highest level when copper powder addition is about 5wt%, which is about 25% higher than that of unmodified adhesive.

关 键 词：陶瓷结合剂超硬材料磨具 环氧树脂胶粘剂 粘接强度 粘接工艺 

分 类 号：TQ433.43[化学工程]